Our division aims to improve control engineering, thin film electronic materials, function of various sensors, and electronic devices.
MEMS Ultrasonic Array Sensor using P(VDF/TrFE) piezoelectric thin films can be adapted for ultrasonic 3D imaging and non-destructive ultrasonic testing systems.
“Make your dreams real!!” We can help you make things with 3D digital processing machines such as a 3D printer, a 3D milling machine, and a 3D scanner.
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